technical data 4309 product description ? high i2t ? high inrush withstand capability ? aec-q200 qualified: (750 ma to 20 a) ? excellent temperature and cycling characteristics ? 1206 (3216 metric) compact design utilizes less board space ? compatible with solder reflow and wave solder ? halogen free, lead free, rohs compliant applications secondary circuit protection ? laptop, notebook, netbook ? tablets, e-readers ? flat panel displays ? high definition television (hdtv) ? lcd/led backlighting ? computers and peripherals ? gaming console systems ? handheld/portable equipment ? mobile device chargers automotive ? central body control module ? heating ventilation and air conditioning controllers (hvac) ? doors, window lift and seat control ? digital instrument cluster ? in-vehicle infotainment (ivi) and navigation ? electric pumps, motor control and auxiliaries ? powertrain control module (pcu)/engine control unit (ecu) ? transmission control unit (tcu) agency information ? curus recognition: file e19180, guide jdyx2/jdyx8 ? aec-q200 qualified (750 ma to 20 a) ordering ? use ordering number (see page 6 for details) packaging suffixes ? -tr (3000 parts per 7 diameter reel, tape width 8 mm) cc12h high i2t chip fuses pb halogen hf free effective april 2016 supersedes november 2014
2 technical data 4309 effective april 2016 cc12h high i2t chip fuses electrical characteristics amp rating % of amp rating opening time 250 ma C 30 a 100% 4 hours minimum 1 a C 3 a 200% 1.0 s C 60 s 25 a C 30 a 200% 120 s max 1 a C 5 a 250% 5.0 s max 1 a C 5 a 300% 0.1 s C 3.0 s 250 ma C 750 ma 350% 5 s max 6 a C 20 a 350% 5 s max 250 ma C 500 ma 1000% 0.01 ms C 1.0 ms 750 ma C 30 a 1000% 0.2 ms C 20 ms product specifications part number current rating (a) voltage rating (v dc ) interrupting rating1 (a) typical dc cold resistance2 (m ) typical pre-arcing3 i2t (a 2 s) typical voltage drop (mv) part marking cc12h250ma 0.25 63 50 3500 0.00038 1400 .25 cc12h375ma 0.375 63 50 1750 0.00077 730 a cc12h500ma 0.5 63 50 980 0.0019 700 .5 cc12h750ma 0.75 63 50 800 0.15 700 e cc12h1a 1 63 50 470 0.18 490 h cc12h1.5a 1.5 63 50 218 0.4 355 k cc12h2a 2 63 50 133 1.1 305 n cc12h2.5a 2.5 63 50 79 1.7 240 o cc12h3a 3 63 50 49 2.2 185 p cc12h3.5a 3.5 63 50 37 2.7 180 r cc12h4a 4 63 50 33 3.2 169 s cc12h4.5a 4.5 32 100 28 4.2 160 x cc12h5a 5 32 100 23 6 140 t cc12h6a 6 32 100 15.5 12 150 f cc12h7a 7 32 100 11.5 18 130 j cc12h8a 8 32 100 7.3 18 110 v cc12h10a 10 32 100 6.5 30 90 u cc12h12a 12 32 100 4.7 45 90 w cc12h15a 15 32 100 3 33 90 y cc12h20a 20 32 100 2 80 90 q cc12h25a 25 32 200 3 60 90 l cc12h30a 30 32 200 2.1 100 90 z 1. dc interrupting rating measured at rated voltage, time constant of less than 50 microseconds, battery source. 2. typical dc cold resistance measured at <10% of rated current. 3. typical pre-arcing i2t value is measured at 10in rated current. www.eaton.com/elx
3 technical data 4309 effective april 2016 cc12h high i2t chip fuses dimensionsCmm packaging information- mm supplied in tape and reel packaging, 3000 parts per 7 diameter reel. www.eaton.com/elx
4 technical data 4309 effective april 2016 cc12h high i2t chip fuses i 2 t vs. time curve cc12h i 2 t (a 2 s) ti me (s ) www.eaton.com/elx
5 technical data 4309 effective april 2016 cc12h high i2t chip fuses time vs. current curve ti me (s ) www.eaton.com/elx
6 technical data 4309 effective april 2016 cc12h high i2t chip fuses temperature derating curve environmental data operating temperature: -55 c to +125 c (with derating); (20 a- 30 a) -40 c to +85 c (with derating) thermal shock: mil- std- 202g, method 107, (300 cycles -55 c to +125 c) vibration: mil-std- 202g, method 204, (20 g's for 20 minutes, 12 cycles in each of 3 orientations, 10- 2000 hz) humidity: mil- std- 202g, method 103, (+85 c, 85% relative humidty, 1000 hours 10% of operating power mechanical shock: mil-std- 202g, method 213, condition c ordering codes the ordering code is the part number replacing the . with a - plus adding the packaging suffix. packaging suffix ? -tr (3000 parts on a 7 reel, tape width 8 mm). part number ordering code -tr option part number ordering code -tr option cc12h250ma cc12h250ma-tr cc12h4a cc12h4a-tr cc12h375ma cc12h375ma-tr cc12h4.5a cc12h4-5a-tr cc12h500ma cc12h500ma-tr cc12h5a cc12h5a-tr cc12h750ma CC12H750MA-TR cc12h6a cc12h6a-tr cc12h1a cc12h1a-tr cc12h7a cc12h7a-tr cc12h1.5a cc12h1-5a-tr cc12h8a cc12h8a-tr cc12h2a cc12h2a-tr cc12h10a cc12h10a-tr cc12h2.5a cc12h2-5a-tr cc12h12a cc12h12a-tr cc12h3a cc12h3a-tr cc12h15a cc12h15a-tr cc12h3.5a cc12h3-5a-tr cc12h20a cc12h20a-tr cc12h25a cc12h25a-tr cc12h30a cc12h30a-tr www.eaton.com/elx
7 technical data 4309 effective april 2016 cc12h high i2t chip fuses wave solder profile reference en 61760-1:2006 profile feature standard snpb solder lead (pb) free solder preheat ? temperature min. (t smin ) 100c 100c ? temperature typ. (t styp ) 120c 120c ? temperature max. (t smax ) 130c 130c ? time (t smin to t smax ) (t s ) 70 seconds 70 seconds d preheat to max temperature 150c max. 150c max. peak temperature (t p )* 235c C 260c 250c C 260c time at peak temperature (t p ) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave ramp-down rate ~ 2 k/s min ~3.5 k/s typ ~5 k/s max ~ 2 k/s min ~3.5 k/s typ ~5 k/s max time 25c to 25c 4 minutes 4 minutes manual solder 350c, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended. te mp eratur e time t sm in t sm ax t st yp t p t p first wa ve second wa ve preheat area cool do wn area www.eaton.com/elx
technical data 4309 effective april 2016 cc12h high i2t chip fuses temperature t t p t s t c -5c ti me 25 c to pe ak ti me 25 c t sm in t sm ax t l t p prehea t a ma x. ra mp up ra te = 3 c/ s ma x. ra mp do wn ra te = 6 c/ s solder reflow profile reference jdec j-std-020d profile feature standard snpb solder lead (pb) free solder preheat and soak ? temperature min. (t smin ) 100c 150c ? temperature max. (t smax ) 150c 200c ? time (t smin to t smax ) (t s ) 60-120 seconds 60-120 seconds average ramp up rate t smax to t p 3c/ second max. 3c/ second max. liquidous temperature (t l l * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 1 - standard snpb solder (t c ) package thickness volume mm3 <350 volume mm3 350 <2.5mm) 235c 220c 2.5mm 220c 220c table 2 - lead (pb) free solder (t c ) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6mm 260c 260c 260c 1.6 C 2.5mm 260c 250c 245c >2.5mm 250c 245c 245c eaton electronics division 1000 eaton boulevard cleveland, oh 44122 united states www.eaton.com/elx ? 2016 eaton all rights reserved printed in usa publication no. 4309 bu-mc16040 april 2016 eaton is a registered trademark. all other trademarks are property of their respective owners. life support policy: eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an offcer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signifcant injur y to the user. eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribu tion of any products. eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
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